Latest Insights and Innovations
Stay ahead with the latest trends and insights from the forefront of PCB and hardware technology.
Stay ahead with the latest trends and insights from the forefront of PCB and hardware technology.
Designed a scalable 64-channel MEMS microphone acquisition system for automotive R&D, using Texas Instruments FPD-Link to serialize multi-channel I²S audio over automotive-grade Rosenberger connectors. Features include phase-coherent capture, EMI-resistant high-speed links, and a modular circular PCB architecture with 16 microphones per board. Ideal for beamforming, noise localization, and acoustic AI datasets, the system is expandable from 16 to 64 microphones without redesign, delivering low-latency, high-resolution audio to an FPGA for real-time processing.
Explore how 3DPHOTONiX provides specialized electronic systems, including advanced inertial measurement units (IMUs) and integrated flight systems, to support the Bath University Rocket Team's competitive and high-altitude rocketry missions.
Explore the intricacies of USB redriver technology, emphasizing the TUSB1044 IC. Discover its role in high-speed USB data transmission, focusing on functionalities, technical specifications, and PCB design integration.
Delve into the intricate world of aerospace PCB design, exploring how it meets the challenges of extreme environments. Learn about the selection of advanced materials, the importance of component reliability and redundancy, and the unique considerations for outgassing, radiation resistance, and mechanical stress management in the demanding realm of aerospace technology.
Explore the intricacies of routing high-speed USB 3.0 and 3.1 signals in USB Type-C connectors, focusing on multiplexing techniques. This piece sheds light on the critical role of components like the TUSB1142 in signal management, offering valuable insights for engineers and PCB designers in achieving optimal USB-C connectivity. Essential for those seeking to understand USB 3.0/3.1 integration, it guides through the challenges of preserving signal integrity in modern, compact USB designs.
